Research group of Dr. Xiaoliang Zeng from Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences made progress on polymer composites with improved thermal conductivity and published their work on ACS Appl. Mater. Interfaces.
In this work, an epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composite was reported through combination of ice-templating self-assembly and infiltration methods. The polymer composites possess a much higher thermal conductivity up to 4.42 W m−1K−1 at relatively low loading 34 vol% than that of random distribution composites (1.81 W m−1K−1 for epoxy/random 3D-BN composites, 1.16 W m−1K−1 for epoxy/random BN composites), exhibit a high glass transition temperature (178.9–229.2 °C) and dimensional stability (22.7 ppm/K). The authors attribute the increased thermal conductivity to the unique oriented 3D-BN thermally conducive network, in which the much higher thermal conductivity along the in-plane direction of BN microplatelets is most useful.